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professional Multi-Layer Ball Grid Array boards manufacturer
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- 7 days
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Product Description
Multi-Layer Boards Ball Grid Array boards
specifications：4layers pcb FR-4,1.2mm Green sold mask white slikscreen OSP
Technology Capability
LAYERS:1-48Layers
Materials: FR-4,CEM-3,Rogers,Halogen Free,Hi-TG,etc
Thickness: 0.2mm-3.0mm
copper thickness: 0.5OZ-6OZ
Solder Mask: Green,Blue,white,black,yellow,etc
Silkscreen: white,black
Surface treatment: OSP,(Leadfree)HAL,Gold-plating,Immersion gold/silver,etc
Other Technology:Gold finger, peelable mask, Non-across blind/buried vias, HDI,characteristic impedance control,high-precision impedance,high frequency h-Tg
Contact Us
- Shenzhen Telionpcb Electronic Co.,LTD
- Contact namexie milan Chat Now
- Phone86-0755-81581472
- Address, Tongchuan, Shaanxi
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